Intel® Server System R1304WF0YSR
Manufacturer Part Number: R1304WF0YSR
Specifications:
- Product Collection: Intel® Server System R1000WF Family
- Code Name: Products formerly Wolf Pass
- Launch Date: Q2'19
- Expected Discontinuance: 2022
- Limited 3-year Warranty: Yes
- Extended Warranty Available for Purchase (Select Countries): Yes
- Additional Extended Warranty Details: Dual Processor System Extended Warranty
- Chassis Form Factor: 1U, Spread Core Rack
- Chassis Dimensions: 16.93" x 27.95" x 1.72"
- Board Form Factor: Custom 16.7" x 17"
- Compatible Product Series: 2nd Generation Intel® Xeon® Scalable Processors
- Socket: Socket P
- TDP: 165 W
- Heat Sink: (2) 1U Standard Heat Sink FXXCA78X108HS
- Heat Sink Included: Yes
- System Board: Intel® Server Board S2600WF0R
- Board Chipset: Intel® C624 Chipset
- Target Market: Mainstream
- Rack-Friendly Board: Yes
- Power Supply: 1100 W
- Power Supply Type: AC
- # of Power Supply Included: 1
- Redundant Power Supported: Supported, requires additional power supply
- Backplanes: Included
- Included Items:
- (1) 1U chassis with Quick Reference Label affixed to top cover
(1) Intel® Server Board S2600WF0R (no onboard LAN)
(2) Riser card assembly with 1 slot PCIe x16 riser card iPC F1UL16RISER3
(4) 3.5” hot-swap drive bays with drive carriers and drive blanks. Includes:
(1) 12 Gb SAS backplane FR1304S3HSBP
(4) 3.5” hot swap drive tool less carriers FXX35HSCAR2
(1) Pre-installed standard control panel assembly
(board only FXXFPANEL2)
260 mm front panel cable
(1) Pre-installed front I/O panel assembly (1 x VGA and 2 x USB)
(1) 150 mm backplane I2C cable
(1) 850 mm mini SAS HD cable AXXCBL850HDHRT
(1) 350 mm backplane power cable
(1) Air duct
(6) Dual rotor system fans FR1UFAN10PW
(1) 1100W power supply module - iPC AXX1100PCRPS
(2) CPU heat sinks, 39 fin passive
(2) CPU heat sink “No CPU” label inserts
(2) Standard CPU Carriers
(8) DIMM slot blanks
(1) Chassis Stif
Supplemental Information
- Description: Integrated 1U system featuring an Intel® Server Board S2600WF0R, supporting two 2nd Generation Intel® Xeon® Scalable processors, (4) 3.5 inch hot-swap drives, 24 DIMMs, (1)1100W redundant-capable power supply, Intel® OCP Module.
Memory & Storage
- Memory Types: DDR4 ECC RDIMM/LRDIMM 2133/2400/2666/2933 & Intel® Optane™ DC Persistent Memory Supported
- Max # of DIMMs: 24
- Max Memory Size (dependent on memory type): 7.5 TB
- # of Front Drives Supported: 4
- Front Drive Form Factor: Hot-swap 3.5" HDD or 2.5" SSD
- # of Internal Drives Supported: 2
- Internal Drive Form Factor: M.2 SSD
- Intel® Optane™ DC Persistent Memory Supported: Yes
Processor Graphics
Expansion Options
- PCIe x24 Riser Super slot: 1
- PCIe x16 Gen 3: 2
- PCIe OCuLink Connectors (NVMe support): 4
- Connector for Intel® Integrated RAID Module: 1
- Riser Slot 1: Total # of Lanes: 24
- Riser Slot 1: Included Slot Configuration(s): 1x PCIe Gen3 x16
- Riser Slot 2: Total # of Lanes: 24
- Riser Slot 2: Included Slot Configuration(s): 1x PCIe Gen3 x16
I/O Specifications
- # of USB Ports: 5
- Total # of SATA Ports: 10
- RAID Configuration: SW RAID 0, 1, 10, optional 5
- # of Serial Ports: 2
- Integrated LAN: 1GbE (mgmt port)
- # of LAN Ports: 1
Package Specifications
Advanced Technologies
- Intel® Optane™ Memory Supported: Yes
- Intel® Remote Management Module Support: Yes
- Integrated BMC with IPMI: IPMI 2.0
- Intel® Node Manager: Yes
- Intel® Virtualization Technology for Directed I/O (VT-d): Yes
- Intel® Rapid Storage Technology enterprise: Yes
- TPM Version: 2.0